Printed circuit heat exchanger
the big picture Plant performance can be improved by running concentrated solar power (CSP) plants at higher temperatures than current designs (i.e., > 565 °C), reducing the levelized cost of electricity (LCOE). The use of a new form of turbine system that works at both high temperature and high pressure is envisaged for next-generation CSP plants. The Department of Energy’s current objectives are to build CSP plants with peak operating temperatures above 750°C, and as a result, the primary heat exchanger is one of the main components being designed for next-generation CSP plants. The heat exchanger converts heat from whatever medium is used to store the sun’s energy (for example, molten salt) to a compressible fluid like a gas or supercritical fluid like supercritical CO2 (SCO2). New materials of greater strength than steel must be used at the temperatures and pressures of interest.
Given the high pressures and temperatures, it could be more cost effective to use a heat exchanger with small channels, such that the total force applied to the channel walls by the high pressure fluid, such as supercritical CO2 (sCO2), is small (note that the force is equal to the applied high pressure times the small channel’s surface area). Since the overall force is minimal, only a small amount of material, on the order of millimeters thick, is required to withstand the high pressure, decreasing the total amount of material required in the heat exchanger and making it easier to produce.
Printed circuit heat exchangers by characteristics
This research presents analytical methodologies for thermal design, mechanical design, and cost estimation of printed circuit heat exchangers. Parallel flow, countercurrent flow, and crossflow are the three flow arrangements considered in this analysis. The analytical solution of the temperature profile of the heat exchanger is introduced for each flow arrangement. The size and cost of printed circuit heat exchangers for advanced small modular reactors using sodium, molten salts, helium, and water are also discussed.
This research presents the analytical methodologies for the thermal design, mechanical design, and cost estimation of printed circuit heat exchangers. Parallel flow, countercurrent flow, and crossflow are the three flow arrangements considered in this analysis. The analytical solution of the temperature profile of the heat exchanger is introduced for each flow arrangement. The size and cost of printed circuit heat exchangers for advanced small modular reactors that use coolants like sodium, molten salts, helium, and water are also addressed.
Transient thermal analysis of compact printed circuit heat
VPE produces diffusion bonded microchannel heat exchangers (MCHEs), also known as printed circuit heat exchangers (PCHEs), for a variety of industries. These small heat exchangers are also well-suited to high-pressure and high-temperature applications.
A cutout of the inner core of a diffusion bonded microchannel heat exchanger is shown above (MCHE). The atoms diffuse together during diffusion bonding, and the center becomes one solid piece at parent material strength.
To satisfy their specific needs, many customers want a custom-designed heat exchanger. As a consequence, we are specialists in custom heat exchangers. As a result, we design and produce heat exchangers in a variety of shapes and sizes in order to optimize efficiency while lowering costs. In addition, we can build a device to your exact specifications or design a custom system to meet your performance requirements.
Hydrogen pre-cooling heat exchangers H2PCsTM are a common application for diffusion bonded microchannel heat exchangers. As a result, we sell a variety of H2PCsTM and hydrogen recuperators in various sizes to accommodate varying hydrogen fill speeds.
The primary purpose of very-high-temperature reactors (VHTRs) is to efficiently produce electricity and provide high-temperature process heat for industrial applications. This is achieved by the use of an effective intermediate heat exchanger (IHX) that moves heat from the primary fluid (helium) to a secondary fluid. Due to its compactness and capability for high-temperature, high-pressure applications with high effectiveness, a printed circuit heat exchanger (PCHE) is one of the leading IHX candidates for use in VHTRs.
A computer code was also created to predict the steady-state and intermittent actions of both straight-channel and zigzag-channel PCHEs. The dynamic model was effective in predicting the experimental transient scenarios, according to comparisons of numerical results with experimental data. The numerical findings may also be useful in developing a control strategy for an integrated high-temperature reactor system with process heat applications, such as adjusting the heat exchanger effectiveness and heat transfer rate using helium mass flow rates or helium inlet temperature variations.